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BSI generations

 From Sony



TSV（硅通孔）技术——通过侧边硅穿孔的方式连接堆栈层，就好像用订书机打穿书页后将上下页四边装订起来一样。基于此的双层堆栈就是Gen2架构，代表产品为IMX700；若加上DRAM层，便是Gen4架构，代表产品为IMX400。


铜互连 Hybrid Bonding（混合键合）技术——不需要打穿上下层硅片，只需以通孔的方式在感光器的上下左右四边的旁电路区域进行电气铜互连，就好像四边有磁性一样直接可以吸合，所以不用留出空位来打孔。


以此为基础的双层堆栈式结构便是Gen3架构，代表产品为IMX600y；加上DRAM层则为Gen6架构，代表产品为IMX557（索尼亲儿子型号）。


铜互连 pixel-level interconnect（像素直连）技术——每个像素底下都直连到了主电路，不再需要旁电路转接，就好像两块等大的磁铁一样互相无间隙相吸。基于此的双层堆栈便是Gen5架构，代表产品为IMX608（华为定制的神仙型号）。

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