OmniVision Technologies, Inc. (Santa Clara, CA, USA; www.ovt.com)
has developed a new approach to NIR imaging dubbed Nyxel technology,
which leverages novel silicon semiconductor architectures and processes.
Nyxel combines thick-silicon pixel
architectures with careful management of wafer surface texture to
improve QE, along with extended deep trench isolation (DTI) to help
retain (modular transfer function) MTF without affecting the sensor's
dark current.
Nyxel:
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